Currently, the most powerful chipset in the Qualcomm series is SNAPDRAGON 865. It powers several flagships launched earlier this year. Now, leaks about his successor have begun to hit the market. The next generation processor is Snapdragon 875, according to Qualcomm’s obvious trend. The best that Snapdragon has to give right now is 865. In this article, we will discuss Qualcomm Snapdragon 875 leaks. We will provide all available information about the new Qualcomm Snapdragon chipset. In addition, we will discuss the characteristics of the Snapdragon 875 chipset and the release date of Snapdragon 875. All details will be based on leaks and expectations about this chipset.
Qualcomm Snapdragon 875 Leaks
According to the leaks, Qualcomm Snapdragon 875 will use a 5nm process, making it a battery-saving processor. A report claims the Snapdragon 875 chipset is codenamed SM8350 and will package the Snapdragon X60 5G modem with an integrated RF system. We do not yet have information on whether the modem will be integrated or optional. The report also reveals that the upcoming new Qualcomm Snapdragon chipset will have a Kryo 685 CPU built with ARM v8 Cortex technology with Adreno 660 GPU, Adreno 65 VPU and Adreno 1095 DPU. In addition, it states that the modem will support the mm-Wave and sub-6GHz band spectra.
Features of the Snapdragon 875 Chipset
SNAPDRAGON 875 can introduce Qualcomm Secure Processing (SPU250) and the Spectra 580 image processing engine with Snapdragon Sensors Core technology. For solid connectivity, you could have Bluetooth Milan and Wi-Fi 802.11ax, 2 × 2 MIMO. The chipset will likely bring Compute Hexagon DSP with Hexagon Vector eXtensions and Hexagon Tensor Accelerator for faster computing. For storage, it will have LPDDR5 SDRAM. It will also feature a low-power audio subsystem combined with Aqstic Audio Technologies’ WCD9380 and WCD9385 audio codec.
Snapdragon 875 Release Date
According to sources, there is hope that the Snapdragon 875 release date will be around December 2020. However, the current situation due to the COVID-19 pandemic, if prolonged, could push the release to the next year.